BACK END PROJECTS

Micron’s DRAM and NAND assembly and test facility.

Operational as of 28th February 2026

Location: Sanand, Gujarat. Investment of about $2.75 billion over two phases. The state-of-the-art facility converts advanced DRAM and NAND wafers from Micron's global manufacturing network into finished memory and storage products. Once fully ramped, the first phase of Micron’s Sanand operation will feature more than 500,000 square feet of cleanroom space, making it one of the world’s largest single-floor assembly and test cleanrooms. The Sanand site is ISO 9001:2015 certified and has begun commercial production. To mark the grand opening of the site, Micron presented its first shipment of made-in-India memory modules to Dell Technologies for its laptops made in India for India. Micron expects to assemble and test tens of millions of chips at Sanand in 2026, scaling to hundreds of millions in 2027. https://investors.micron.com/news-releases/news-release-details/micron-celebrates-opening-indias-first-semiconductor-assembly 

Semiconductor ATMP unit in Assam

Operational by early 2026

Tata Semiconductor Assembly and Test Pvt Ltd ("TSAT") will set up a semiconductor unit in Morigaon, Assam. This unit will be set up with an investment of $ 3.2 Billion. TSAT semiconductor is developing indigenous advanced semiconductor packaging technologies including flip chip and ISIP (integrated system in package) technologies. Capacity is 48 million per day.

Semiconductor ATMP unit for specialized chips

Operational by 2027

CG Power, in partnership with Renesas Electronics Corporation, Japan and Stars Microelectronics, Thailand will set up a semiconductor unit in Sanand, Gujarat. This unit will be set up with an investment of about $ 1 Billion. The unit will manufacture chips for consumer, industrial, automotive and power applications and will have a capacity of 15 million per day. 

Semiconductor ATMP unit for specialized chips

Operational by 2028

HCL and Foxconn, will set up a semiconductor unit in Jewar, U.P.. This unit will be set up with an investment of about $ 434 Million. The unit will manufacture WLP display driver chips and will have a capacity of 20,000 wafers per month, 36 million chips per month.

Semiconductor ATMP unit for specialized chips

Operational by 2027

Kaynes Semicon, will set up a semiconductor unit in Sanand, Gujarat. Their initial plans for a unit in Tamil Nadu were scuppered by ISM. This unit will be set up with an investment of about $ 413 Million. The unit will manufacture chips for the domestic (30%) as well as the international market (70%) and will have a capacity of 6 million per day. They plan to have about 13 chip assembly and test lines.

Semiconductor ATMP/OSAT unit for specialized chips

Operational by ~2027-28 (no official date announced)

3D Glass Solutions Inc. will set up a facility for advanced packaging and embedded glass substrate technology (e.g., glass interposers, silicon bridges, 3D heterogeneous integration) in Bhubaneswar, Odisha. It will have the capacity of about ~69,600 glass substrates, 50 million assembled units, and 13,200 3DHI modules annually. Applications include AI, HPC, automotive, photonics, RF, defence, co-packaged optics.

Semiconductor ATMP/OSAT unit for specialized chips

Operational by ~2027-28 (no official date announced)

Advanced System in Package (ASIP) Technologies, in partnership with South Korea's APACT Co. Ltd., will be setting up a facility for packaging and assembly in Tarluvada, Visakhapatnam, Andhra Pradesh. The capacity will be 96 million packaged units/year and the applications include Mobile phones, set-top boxes, automotive electronics, and other consumer electronic products.

Semiconductor ATMP/OSAT unit for specialized chips

Operational by 2027 (partial capacity possible sooner)

Continental Device India Ltd (CDIL) is expanding an existing facility to manufacture high-power discrete devices (MOSFETs, IGBTs, Schottky diodes, transistors) in both Silicon and Silicon Carbide to a capacity of ~158.38 million units/year. Applications include EVs, charging infrastructure, renewable energy, industrial systems, telecom, power conversion. While primarily back-end / discrete semiconductor production — it also involves some front-end fabrication.